Abstract
Taking Van der Waals force and cleaning force due to fast thermal expansion of substrate surface induced by pulsed laser irradiation into account, a cleaning model was established for removal of tiny particles from substrate surfaces. The cleaning condition and cleaning threshold can be obtained from this model. Theoretical predictions have been verified by the experimental results for removing quartz particles from silicon substrate. For laser-induced removal of quartz particles from silicon substrate surfaces, the cleaning threshold is about 135 mJ/cm2. Cleaning efficiency increases with increasing laser fluence, and large particles can be removed more easily than small ones.
| Original language | English (US) |
|---|---|
| Pages (from-to) | L1304-L1306 |
| Journal | Japanese Journal of Applied Physics, Part 2: Letters |
| Volume | 36 |
| Issue number | 10 PART A |
| DOIs | |
| State | Published - Oct 1 1997 |
Keywords
- Adhesion force
- Cleaning force
- Cleaning model
- Cleaning threshold
- Laser cleaning
- Particle removal
- Quartz particle
- Silicon substrate
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy (miscellaneous)
- Physics and Astronomy(all)
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Lu, Y. F., Song, W. D., Ye, K. D., Lee, Y. P., Chan, D. S. H., & Low, T. S. (1997). A cleaning model for removal of particles due to laser-induced thermal expansion of substrate surface. Japanese Journal of Applied Physics, Part 2: Letters, 36(10 PART A), L1304-L1306. https://doi.org/10.1143/jjap.36.l1304