A cleaning model for removal of particles due to laser-induced thermal expansion of substrate surface

Yong Feng Lu; Wen Dong Song; Kai Dong Ye; Yuan Ping Lee; Daniel S.H. Chan; Teck Seng Low

doi:10.1143/jjap.36.l1304

A cleaning model for removal of particles due to laser-induced thermal expansion of substrate surface

Yong Feng Lu, Wen Dong Song, Kai Dong Ye, Yuan Ping Lee, Daniel S.H. Chan, Teck Seng Low

Research output: Contribution to journal › Article › peer-review

32 Scopus citations

Abstract

Taking Van der Waals force and cleaning force due to fast thermal expansion of substrate surface induced by pulsed laser irradiation into account, a cleaning model was established for removal of tiny particles from substrate surfaces. The cleaning condition and cleaning threshold can be obtained from this model. Theoretical predictions have been verified by the experimental results for removing quartz particles from silicon substrate. For laser-induced removal of quartz particles from silicon substrate surfaces, the cleaning threshold is about 135 mJ/cm². Cleaning efficiency increases with increasing laser fluence, and large particles can be removed more easily than small ones.

Original language	English (US)
Pages (from-to)	L1304-L1306
Journal	Japanese Journal of Applied Physics
Volume	36
Issue number	10 PART A
DOIs	https://doi.org/10.1143/jjap.36.l1304
State	Published - Oct 1 1997
Externally published	Yes

Keywords

Adhesion force
Cleaning force
Cleaning model
Cleaning threshold
Laser cleaning
Particle removal
Quartz particle
Silicon substrate

ASJC Scopus subject areas

Engineering(all)
Physics and Astronomy(all)

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10.1143/jjap.36.l1304

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title = "A cleaning model for removal of particles due to laser-induced thermal expansion of substrate surface",

abstract = "Taking Van der Waals force and cleaning force due to fast thermal expansion of substrate surface induced by pulsed laser irradiation into account, a cleaning model was established for removal of tiny particles from substrate surfaces. The cleaning condition and cleaning threshold can be obtained from this model. Theoretical predictions have been verified by the experimental results for removing quartz particles from silicon substrate. For laser-induced removal of quartz particles from silicon substrate surfaces, the cleaning threshold is about 135 mJ/cm2. Cleaning efficiency increases with increasing laser fluence, and large particles can be removed more easily than small ones.",

keywords = "Adhesion force, Cleaning force, Cleaning model, Cleaning threshold, Laser cleaning, Particle removal, Quartz particle, Silicon substrate",

author = "Lu, {Yong Feng} and Song, {Wen Dong} and Ye, {Kai Dong} and Lee, {Yuan Ping} and Chan, {Daniel S.H.} and Low, {Teck Seng}",

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T1 - A cleaning model for removal of particles due to laser-induced thermal expansion of substrate surface

AU - Lu, Yong Feng

AU - Song, Wen Dong

AU - Ye, Kai Dong

AU - Lee, Yuan Ping

AU - Chan, Daniel S.H.

AU - Low, Teck Seng

PY - 1997/10/1

Y1 - 1997/10/1

N2 - Taking Van der Waals force and cleaning force due to fast thermal expansion of substrate surface induced by pulsed laser irradiation into account, a cleaning model was established for removal of tiny particles from substrate surfaces. The cleaning condition and cleaning threshold can be obtained from this model. Theoretical predictions have been verified by the experimental results for removing quartz particles from silicon substrate. For laser-induced removal of quartz particles from silicon substrate surfaces, the cleaning threshold is about 135 mJ/cm2. Cleaning efficiency increases with increasing laser fluence, and large particles can be removed more easily than small ones.

AB - Taking Van der Waals force and cleaning force due to fast thermal expansion of substrate surface induced by pulsed laser irradiation into account, a cleaning model was established for removal of tiny particles from substrate surfaces. The cleaning condition and cleaning threshold can be obtained from this model. Theoretical predictions have been verified by the experimental results for removing quartz particles from silicon substrate. For laser-induced removal of quartz particles from silicon substrate surfaces, the cleaning threshold is about 135 mJ/cm2. Cleaning efficiency increases with increasing laser fluence, and large particles can be removed more easily than small ones.

KW - Adhesion force

KW - Cleaning force

KW - Cleaning model

KW - Cleaning threshold

KW - Laser cleaning

KW - Particle removal

KW - Quartz particle

KW - Silicon substrate

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A cleaning model for removal of particles due to laser-induced thermal expansion of substrate surface

Abstract

Keywords

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