Additive manufacturing of copper/diamond composites for thermal management applications

Loic Constantin, Lisha Fan, Mael Pontoreau, Fei Wang, Bai Cui, Jean Luc Battaglia, Jean François Silvain, Yong Feng Lu

Research output: Contribution to journalArticle

Abstract

Copper (Cu)/diamond (D) composites have excellent thermal properties but are hard to manufacture with conventional methods. Additive manufacturing (AM) can overcome this issue because of its high degree of freedom to fabricate complex designs. In this letter, we demonstrate the laser directed energy deposition of Cu/D composites. D particles were coated with graded TiO2-TiC interphase to enhance its wettability with molten Cu. A relatively dense Cu/25 vol% coated-D composite was printed (96%) at an energy density of 1200 J/mm3 (power = 900 W, scan = 12.7 mm/s) with high thermal conductivity (330 W/m.K), and no graphitization of the D.

Original languageEnglish (US)
Pages (from-to)61-66
Number of pages6
JournalManufacturing Letters
Volume24
DOIs
StatePublished - Apr 2020

Keywords

  • Additive manufacturing
  • Composites
  • Copper
  • Diamond
  • Interphase

ASJC Scopus subject areas

  • Mechanics of Materials
  • Industrial and Manufacturing Engineering

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  • Cite this

    Constantin, L., Fan, L., Pontoreau, M., Wang, F., Cui, B., Battaglia, J. L., Silvain, J. F., & Lu, Y. F. (2020). Additive manufacturing of copper/diamond composites for thermal management applications. Manufacturing Letters, 24, 61-66. https://doi.org/10.1016/j.mfglet.2020.03.014