Additive manufacturing of copper/diamond composites for thermal management applications

Loic Constantin; Lisha Fan; Mael Pontoreau; Fei Wang; Bai Cui; Jean Luc Battaglia; Jean François Silvain; Yong Feng Lu

doi:10.1016/j.mfglet.2020.03.014

Additive manufacturing of copper/diamond composites for thermal management applications

Loic Constantin, Lisha Fan, Mael Pontoreau, Fei Wang, Bai Cui, Jean Luc Battaglia, Jean François Silvain, Yong Feng Lu

Electrical & Computer Engineering

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Abstract

Copper (Cu)/diamond (D) composites have excellent thermal properties but are hard to manufacture with conventional methods. Additive manufacturing (AM) can overcome this issue because of its high degree of freedom to fabricate complex designs. In this letter, we demonstrate the laser directed energy deposition of Cu/D composites. D particles were coated with graded TiO₂-TiC interphase to enhance its wettability with molten Cu. A relatively dense Cu/25 vol% coated-D composite was printed (96%) at an energy density of 1200 J/mm³ (power = 900 W, scan = 12.7 mm/s) with high thermal conductivity (330 W/m.K), and no graphitization of the D.

Original language	English (US)
Pages (from-to)	61-66
Number of pages	6
Journal	Manufacturing Letters
Volume	24
DOIs	https://doi.org/10.1016/j.mfglet.2020.03.014
State	Published - Apr 2020

Keywords

Additive manufacturing
Composites
Copper
Diamond
Interphase

ASJC Scopus subject areas

Mechanics of Materials
Industrial and Manufacturing Engineering

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10.1016/j.mfglet.2020.03.014

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@article{4fc116143df440d8885ec8a206efbece,

title = "Additive manufacturing of copper/diamond composites for thermal management applications",

abstract = "Copper (Cu)/diamond (D) composites have excellent thermal properties but are hard to manufacture with conventional methods. Additive manufacturing (AM) can overcome this issue because of its high degree of freedom to fabricate complex designs. In this letter, we demonstrate the laser directed energy deposition of Cu/D composites. D particles were coated with graded TiO2-TiC interphase to enhance its wettability with molten Cu. A relatively dense Cu/25 vol% coated-D composite was printed (96%) at an energy density of 1200 J/mm3 (power = 900 W, scan = 12.7 mm/s) with high thermal conductivity (330 W/m.K), and no graphitization of the D.",

keywords = "Additive manufacturing, Composites, Copper, Diamond, Interphase",

author = "Loic Constantin and Lisha Fan and Mael Pontoreau and Fei Wang and Bai Cui and Battaglia, {Jean Luc} and Silvain, {Jean Fran{\c c}ois} and Lu, {Yong Feng}",

note = "Funding Information: Manufacturing and characterization analyses were performed at the NanoEngineering Research Core Facility (part of the Nebraska Nanoscale Facility), which is partially funded from the Nebraska Research Initiative. The authors would like to thank Jamie Eske for her help on the English editing. Publisher Copyright: {\textcopyright} 2020",

year = "2020",

month = apr,

doi = "10.1016/j.mfglet.2020.03.014",

language = "English (US)",

volume = "24",

pages = "61--66",

journal = "Manufacturing Letters",

issn = "2213-8463",

publisher = "Society of Manufacturing Engineers",

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TY - JOUR

T1 - Additive manufacturing of copper/diamond composites for thermal management applications

AU - Constantin, Loic

AU - Fan, Lisha

AU - Pontoreau, Mael

AU - Wang, Fei

AU - Cui, Bai

AU - Battaglia, Jean Luc

AU - Silvain, Jean François

AU - Lu, Yong Feng

N1 - Funding Information: Manufacturing and characterization analyses were performed at the NanoEngineering Research Core Facility (part of the Nebraska Nanoscale Facility), which is partially funded from the Nebraska Research Initiative. The authors would like to thank Jamie Eske for her help on the English editing. Publisher Copyright: © 2020

PY - 2020/4

Y1 - 2020/4

N2 - Copper (Cu)/diamond (D) composites have excellent thermal properties but are hard to manufacture with conventional methods. Additive manufacturing (AM) can overcome this issue because of its high degree of freedom to fabricate complex designs. In this letter, we demonstrate the laser directed energy deposition of Cu/D composites. D particles were coated with graded TiO2-TiC interphase to enhance its wettability with molten Cu. A relatively dense Cu/25 vol% coated-D composite was printed (96%) at an energy density of 1200 J/mm3 (power = 900 W, scan = 12.7 mm/s) with high thermal conductivity (330 W/m.K), and no graphitization of the D.

AB - Copper (Cu)/diamond (D) composites have excellent thermal properties but are hard to manufacture with conventional methods. Additive manufacturing (AM) can overcome this issue because of its high degree of freedom to fabricate complex designs. In this letter, we demonstrate the laser directed energy deposition of Cu/D composites. D particles were coated with graded TiO2-TiC interphase to enhance its wettability with molten Cu. A relatively dense Cu/25 vol% coated-D composite was printed (96%) at an energy density of 1200 J/mm3 (power = 900 W, scan = 12.7 mm/s) with high thermal conductivity (330 W/m.K), and no graphitization of the D.

KW - Additive manufacturing

KW - Composites

KW - Copper

KW - Diamond

KW - Interphase

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U2 - 10.1016/j.mfglet.2020.03.014

DO - 10.1016/j.mfglet.2020.03.014

M3 - Article

AN - SCOPUS:85082742470

SN - 2213-8463

VL - 24

SP - 61

EP - 66

JO - Manufacturing Letters

JF - Manufacturing Letters

ER -

Additive manufacturing of copper/diamond composites for thermal management applications

Abstract

Keywords

ASJC Scopus subject areas

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