Assessment of thermal performance of electronic enclosures with rectangular fins: A passive thermal solution

A. Tamayol, F. McGregor, E. Demian, E. Trandafir, P. Bowler, P. Rada, M. Bahrami

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Passive heat transfer from enclosures with rectangular fins is studied both experimentally and theoretically. Several sample enclosures with various lengths are prepared and tested. To calibrate the thermal measurements and the analyses, enclosures without fins ("bare" enclosures) are also prepared and tested. Surface temperature distribution is determined for various enclosure lengths and heat generation rates. Existing relationships for natural convection and radiation heat transfer are used to calculate the heat transfer rate of the tested samples. The theoretical results successfully predict the trends observed in the experimental data. It is observed that the contribution of the radiation heat transfer is on the order of 50% of the total heat transfer for the tested enclosures. As such, a new correlation is reported for calculating optimum fin spacing in uniformly finned surfaces, with rectangular straight fins, that takes into account both natural convection and radiation.

Original languageEnglish (US)
Title of host publicationASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Pages269-276
Number of pages8
DOIs
StatePublished - 2011
EventASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States
Duration: Jul 6 2011Jul 8 2011

Publication series

NameASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume2

Other

OtherASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
CountryUnited States
CityPortland, OR
Period7/6/117/8/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Tamayol, A., McGregor, F., Demian, E., Trandafir, E., Bowler, P., Rada, P., & Bahrami, M. (2011). Assessment of thermal performance of electronic enclosures with rectangular fins: A passive thermal solution. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (pp. 269-276). (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 2). https://doi.org/10.1115/IPACK2011-52174