Conjugate heat transfer from a two-layer substrate model of a convectively cooled circuit board

S. A. Harman, K. D. Cole

Research output: Contribution to journalArticlepeer-review

3 Scopus citations
Original languageEnglish (US)
Pages (from-to)156-158
Number of pages3
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume123
Issue number2
DOIs
StatePublished - Jun 2001

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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