Controlling Interfacial Exchanges in Liquid Phase Bonding Enables Formation of Strong and Reliable Cu-Sn Soldering for High-Power and Temperature Applications

Jean François Silvain, Loic Constantin, Jean Marc Heintz, Sylvie Bordère, Lionel Teule-Gay, Yong Feng Lu, Jean Luc Diot, Renaud De Langlade, Emilien Feuillet

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3 Scopus citations

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Chemical Compounds

Engineering & Materials Science