TY - JOUR
T1 - Copper-carbon and aluminum-carbon composites fabricated by powder metallurgy processes
AU - Silvain, Jean François
AU - Veillère, Amélie
AU - Lu, Yongfeng
PY - 2014
Y1 - 2014
N2 - The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials, with high thermal conductivity and thermal- expansion coefficient compatible with chip materials still ensuring the reliability of the power modules. In this context, metal matrix composites: carbon fibers and diamond-reinforced copper and aluminum matrix composites among them are considered very promising as a next generation of thermal-management materials in power electronic packages. These composites exhibit enhanced thermal properties compared to pure copper combined with lower density. This article presents the fabrication techniques of copper/carbon fibers and copper/diamond and aluminum/carbon fibers composite films by powder metallurgy and hot pressing. The thermal analyses clearly indicate that interfacial treatments are required in these composites to achieve high thermomechanical properties. Interfaces (through novel chemical and processing methods), when selected carefully and processed properly will form the right chemical/mechanical link between metal and carbon, enhancing all the desired thermal properties while minimizing the deleterious effect.
AB - The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials, with high thermal conductivity and thermal- expansion coefficient compatible with chip materials still ensuring the reliability of the power modules. In this context, metal matrix composites: carbon fibers and diamond-reinforced copper and aluminum matrix composites among them are considered very promising as a next generation of thermal-management materials in power electronic packages. These composites exhibit enhanced thermal properties compared to pure copper combined with lower density. This article presents the fabrication techniques of copper/carbon fibers and copper/diamond and aluminum/carbon fibers composite films by powder metallurgy and hot pressing. The thermal analyses clearly indicate that interfacial treatments are required in these composites to achieve high thermomechanical properties. Interfaces (through novel chemical and processing methods), when selected carefully and processed properly will form the right chemical/mechanical link between metal and carbon, enhancing all the desired thermal properties while minimizing the deleterious effect.
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U2 - 10.1088/1742-6596/525/1/012015
DO - 10.1088/1742-6596/525/1/012015
M3 - Conference article
AN - SCOPUS:84904122205
SN - 1742-6588
VL - 525
JO - Journal of Physics: Conference Series
JF - Journal of Physics: Conference Series
IS - 1
M1 - 012015
T2 - Eurotherm Seminar 102: Thermal Management of Electronic Systems
Y2 - 18 June 2014 through 20 June 2014
ER -