Copper-carbon and aluminum-carbon composites fabricated by powder metallurgy processes

Keyphrases

• Powder Metallurgy Method 100%
• Thermal Properties 100%
• Carbon Composite 100%
• Power Electronics 100%
• Carbon Fiber 50%
• Hot Pressing 50%
• Pure Copper 50%
• High Thermal Conductivity 50%
• Interfacial Treatment 50%
• Thermal Analysis 50%
• Thermomechanical Properties 50%
• Mechanical Link 50%
• Novel Chemicals 50%
• Electronic Packaging 50%
• Powder Metallurgy 50%
• Packing Density 50%
• Power Density 50%
• Heat Dissipating 50%
• Composite Carbon Nanofibers 50%
• Power Module 50%
• Effective Temperature 50%
• Thermal Management Materials 50%
• Chip Materials 50%
• Processing Methods 50%
• Aluminum Matrix Composites 50%
• Diamond-copper Composites 50%
• Aluminum-copper Alloy 50%
• Coefficient of Thermal Expansion 50%
• Fabrication Methods 50%
• Chemical Method 50%
• Novel Processing 50%
• Metal Matrix Composites 50%
• Copper Matrix Composites 50%
• Market Demand 50%
• Carbon Fiber Composite 50%

Engineering

• Carbon Composite 100%
• Powder Metallurgy 100%
• Processing Method 50%
• Pure Copper 50%
• Power Electronic Device 50%
• Carbon Fibre Composite 50%
• Power Density 50%
• Packing Density 50%
• Fabrication Technique 50%
• Hot Pressing 50%
• High Thermal Conductivity 50%
• Metal Matrix Composite 50%
• Power Electronics 50%
• Aluminum Matrix 50%

Material Science

• Powder Metallurgy 100%
• Carbon Fiber 100%
• Thermal Property 66%
• Thermal Conductivity 33%
• Metal Matrix Composite 33%
• Matrix Composite 33%
• Thermomechanical Property 33%
• Hot Pressing 33%
• Thermal Analysis 33%