Keyphrases
Powder Metallurgy Method
100%
Thermal Properties
100%
Carbon Composite
100%
Power Electronics
100%
Carbon Fiber
50%
Hot Pressing
50%
Pure Copper
50%
High Thermal Conductivity
50%
Interfacial Treatment
50%
Thermal Analysis
50%
Thermomechanical Properties
50%
Mechanical Link
50%
Novel Chemicals
50%
Electronic Packaging
50%
Powder Metallurgy
50%
Packing Density
50%
Power Density
50%
Heat Dissipating
50%
Composite Carbon Nanofibers
50%
Power Module
50%
Effective Temperature
50%
Thermal Management Materials
50%
Chip Materials
50%
Processing Methods
50%
Aluminum Matrix Composites
50%
Diamond-copper Composites
50%
Aluminum-copper Alloy
50%
Coefficient of Thermal Expansion
50%
Fabrication Methods
50%
Chemical Method
50%
Novel Processing
50%
Metal Matrix Composites
50%
Copper Matrix Composites
50%
Market Demand
50%
Carbon Fiber Composite
50%
Engineering
Carbon Composite
100%
Powder Metallurgy
100%
Processing Method
50%
Pure Copper
50%
Power Electronic Device
50%
Carbon Fibre Composite
50%
Power Density
50%
Packing Density
50%
Fabrication Technique
50%
Hot Pressing
50%
High Thermal Conductivity
50%
Metal Matrix Composite
50%
Power Electronics
50%
Aluminum Matrix
50%
Material Science
Powder Metallurgy
100%
Carbon Fiber
100%
Thermal Property
66%
Thermal Conductivity
33%
Metal Matrix Composite
33%
Matrix Composite
33%
Thermomechanical Property
33%
Hot Pressing
33%
Thermal Analysis
33%