@inproceedings{2678025474964e618923894986e20f98,
title = "Cu/CNT composite materials with enhance mechanical and thermal properties",
abstract = "In this present work, two methods for dispersing carbon nanotubes into the copper matrix were tested: a Solid Route process where CNTs are simply mixed with the copper powder and a Liquid Route process where CNTs are dispersed in a copper salt solution and then mixed with the metallic copper powder. Powders are sintered by uni-axial hot pressing process under vacuum atmosphere at 650°C and thermal conductivities of composite materials were measured using the laser flash method. Results are compared with a theoretical model of Nan et al. which enables to predict the thermal conductivity of materials containing CNTs. Comparison of experimental and theoretical results tends to prove that CNTs are 2D-randomly dispersed in a plane perpendicular to the pressing direction during uni-axial hot pressing process. Moreover, an increase of +7% of the thermal conductivity is shown for the composite material containing 1 vol.% of CNTs into the copper matrix.",
author = "Silvain, {J. F.} and M. Dunant and Y. Lu and Vallet, {G. M.}",
year = "2015",
language = "English (US)",
series = "NSTI: Advanced Materials - TechConnect Briefs 2015",
publisher = "Taylor and Francis Inc.",
pages = "384--387",
editor = "Bart Romanowicz and Matthew Laudon",
booktitle = "NSTI",
note = "10th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 18th Annual Nanotech Conference and Expo, and the 2015 National SBIR/STTR Conference ; Conference date: 14-06-2015 Through 17-06-2015",
}