TY - GEN
T1 - Design, fabrication, and characterization of a scalable tissue-engineered-electronic-nerve-interface (TEENI) device
AU - Desai, Vidhi H.
AU - Spearman, Benjamin S.
AU - Shafor, Chancellor S.
AU - Natt, Sruthi
AU - Teem, Brandon
AU - Graham, James B.
AU - Atkinson, Eric W.
AU - Wachs, Rebecca A.
AU - Nunamaker, Elizabeth A.
AU - Otto, Kevin J.
AU - Schmidt, Christine E.
AU - Judy, Jack W.
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/8/10
Y1 - 2017/8/10
N2 - In this study, we describe a novel peripheral-nerve interface which makes use of highly flexible multi-electrode arrays that are integrated into hydrogel-based scaffolds to form a hybrid tissue-engineered electronic construct. This tissue-engineered electronic nerve interface (TEENI) is designed to be scalable to high channel counts using multiple polyimide-based 'threads' that are evenly distributed through a volume of the nerve equal to its diameter times the distance between one or more nodes of Ranvier. Such scalability could greatly increase the precision and resolution of motor-control and sensory-feedback signals exchanged between amputees and advanced upper-limb prosthetic devices.
AB - In this study, we describe a novel peripheral-nerve interface which makes use of highly flexible multi-electrode arrays that are integrated into hydrogel-based scaffolds to form a hybrid tissue-engineered electronic construct. This tissue-engineered electronic nerve interface (TEENI) is designed to be scalable to high channel counts using multiple polyimide-based 'threads' that are evenly distributed through a volume of the nerve equal to its diameter times the distance between one or more nodes of Ranvier. Such scalability could greatly increase the precision and resolution of motor-control and sensory-feedback signals exchanged between amputees and advanced upper-limb prosthetic devices.
UR - http://www.scopus.com/inward/record.url?scp=85028624102&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85028624102&partnerID=8YFLogxK
U2 - 10.1109/NER.2017.8008326
DO - 10.1109/NER.2017.8008326
M3 - Conference contribution
AN - SCOPUS:85028624102
T3 - International IEEE/EMBS Conference on Neural Engineering, NER
SP - 203
EP - 206
BT - 8th International IEEE EMBS Conference on Neural Engineering, NER 2017
PB - IEEE Computer Society
T2 - 8th International IEEE EMBS Conference on Neural Engineering, NER 2017
Y2 - 25 May 2017 through 28 May 2017
ER -