Effects of polyimide structure and morphology on adhesion to metals

R. F. Saraf, J. M. Roldan, S. Ostrander, T. Derderian

Research output: Contribution to conferencePaper

Abstract

Semi-flexible polyimides (PI's) such as PMDA-ODA and BPDA-PDA are used in the microelectronics industry as dielectric materials. Generally, the applications of these materials require good adhesion between the circuitization metal (usually Cu) and polyimide (PI). However, the adhesion between Cu and PI is well below the design specifications. This problem can be circumvented by either employing an organic adhesive layer or reactive metals such as Cr. In this study, the physical aspects of PI that lead to poor adhesion properties are examined. Following this, a method is proposed to tailor the structure of PI for adhesion enhancement.

Original languageEnglish (US)
Number of pages1
StatePublished - 1995
EventProceedings of the 53rd Annual Technical Conference. Part 1 (of 3) - Boston, MA, USA
Duration: May 7 1995Oct 11 1995

Other

OtherProceedings of the 53rd Annual Technical Conference. Part 1 (of 3)
CityBoston, MA, USA
Period5/7/9510/11/95

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Polymers and Plastics

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    Saraf, R. F., Roldan, J. M., Ostrander, S., & Derderian, T. (1995). Effects of polyimide structure and morphology on adhesion to metals. Paper presented at Proceedings of the 53rd Annual Technical Conference. Part 1 (of 3), Boston, MA, USA, .