Enhanced pool-boiling heat transfer and critical heat flux using femtosecond laser surface processing

Corey M. Kruse, Troy Anderson, Chris Wilson, Craig Zuhlke, Dennis Alexander, George Gogos, Sidy Ndao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

In this paper, we present the experimental investigation of pool boiling heat transfer on multiscale (micro/nano) functionalized metallic surfaces. The multiscale structures were fabricated via a femtosecond laser surface process (FLSP) technique which forms mound-like microstructures covered by layers of nanoparticles. Using a pool boiling experimental setup with deionized water as the working fluid, both the heat transfer coefficient and critical heat flux were investigated. The polished reference sample was found to have a critical heat flux of 91 W/cm2at 40 °C of superheat and a maximum heat transfer coefficient of 23,000 W/m2-K. The processed sample was found to have a critical heat flux of 122 W/cm2at 18 °C superheat and a maximum heat transfer coefficient of 67,400 W/m2-K. Flow visualization revealed nucleate boiling to be the main two-phase heat transfer mechanism. The overall heat transfer performance of the metallic multiscale structured surface has been attributed to both augmented heat transfer surface area and enhanced nucleate boiling regime. On the other hand, increase in the critical heat flux can be attributed to the superhydrophilic nature of the laser processed surface and the presence of nanoparticle layers.

Original languageEnglish (US)
Title of host publicationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages444-451
Number of pages8
ISBN (Electronic)9781479952670
DOIs
StatePublished - Sep 4 2014
Event14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014 - Orlando, United States
Duration: May 27 2014May 30 2014

Publication series

NameThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Conference

Conference14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014
CountryUnited States
CityOrlando
Period5/27/145/30/14

Keywords

  • Critical Heat Flux
  • Femtosecond Laser Surface Processing
  • Metallic Surface Enhancement
  • Pool Boiling
  • heat transfer coefficient

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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