Femtosecond laser drilling of high aspect ratio 1 μm holes in silicon

Dennis R. Alexander; Brian Mihulka; David Doerr

doi:10.1117/12.482107

Femtosecond laser drilling of high aspect ratio 1 μm holes in silicon

Dennis R. Alexander, Brian Mihulka, David Doerr

Electrical & Computer Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

There is a need in many scientific and manufacturing processes to drill small diameter holes with high aspect ratios in both brittle materials as well as metals. Femtosecond lasers operating at 795 nm or frequency doubled to 400 nm provide a unique tool for carrying out these processes. In this work, the femtosecond laser nanomachining facilities at the University of Nebraska is used to drill 1 μm holes in Si/SiO₂ with aspect ratios > 8. The quality of the cut and the small nanoparticles are discussed. Two methods of eliminating the unwanted particles around the cut are discussed.

Original language	English (US)
Pages (from-to)	383-393
Number of pages	11
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4760
Issue number	I
DOIs	https://doi.org/10.1117/12.482107
State	Published - 2002
Event	High-Power Laser Ablation IV - Taos, United States Duration: Apr 22 2002 → Apr 26 2002

Keywords

Femtosecond
Laser ablation
Lasers
Micromachining
Nanomachining
Semiconductor processing

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.482107

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@article{ca7ffccc14e34e4fb50dfab2b3712dab,

title = "Femtosecond laser drilling of high aspect ratio 1 μm holes in silicon",

abstract = "There is a need in many scientific and manufacturing processes to drill small diameter holes with high aspect ratios in both brittle materials as well as metals. Femtosecond lasers operating at 795 nm or frequency doubled to 400 nm provide a unique tool for carrying out these processes. In this work, the femtosecond laser nanomachining facilities at the University of Nebraska is used to drill 1 μm holes in Si/SiO2 with aspect ratios > 8. The quality of the cut and the small nanoparticles are discussed. Two methods of eliminating the unwanted particles around the cut are discussed.",

keywords = "Femtosecond, Laser ablation, Lasers, Micromachining, Nanomachining, Semiconductor processing",

author = "Alexander, {Dennis R.} and Brian Mihulka and David Doerr",

year = "2002",

doi = "10.1117/12.482107",

language = "English (US)",

volume = "4760",

pages = "383--393",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

number = "I",

note = "High-Power Laser Ablation IV ; Conference date: 22-04-2002 Through 26-04-2002",

}

TY - JOUR

T1 - Femtosecond laser drilling of high aspect ratio 1 μm holes in silicon

AU - Alexander, Dennis R.

AU - Mihulka, Brian

AU - Doerr, David

PY - 2002

Y1 - 2002

N2 - There is a need in many scientific and manufacturing processes to drill small diameter holes with high aspect ratios in both brittle materials as well as metals. Femtosecond lasers operating at 795 nm or frequency doubled to 400 nm provide a unique tool for carrying out these processes. In this work, the femtosecond laser nanomachining facilities at the University of Nebraska is used to drill 1 μm holes in Si/SiO2 with aspect ratios > 8. The quality of the cut and the small nanoparticles are discussed. Two methods of eliminating the unwanted particles around the cut are discussed.

AB - There is a need in many scientific and manufacturing processes to drill small diameter holes with high aspect ratios in both brittle materials as well as metals. Femtosecond lasers operating at 795 nm or frequency doubled to 400 nm provide a unique tool for carrying out these processes. In this work, the femtosecond laser nanomachining facilities at the University of Nebraska is used to drill 1 μm holes in Si/SiO2 with aspect ratios > 8. The quality of the cut and the small nanoparticles are discussed. Two methods of eliminating the unwanted particles around the cut are discussed.

KW - Femtosecond

KW - Laser ablation

KW - Lasers

KW - Micromachining

KW - Nanomachining

KW - Semiconductor processing

UR - http://www.scopus.com/inward/record.url?scp=0036442802&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036442802&partnerID=8YFLogxK

U2 - 10.1117/12.482107

DO - 10.1117/12.482107

M3 - Conference article

AN - SCOPUS:0036442802

SN - 0277-786X

VL - 4760

SP - 383

EP - 393

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

IS - I

T2 - High-Power Laser Ablation IV

Y2 - 22 April 2002 through 26 April 2002

ER -

Femtosecond laser drilling of high aspect ratio 1 μm holes in silicon

Abstract

Keywords

ASJC Scopus subject areas

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