Grain Size Measurement of Copper Spot Welding Caps Via Ultrasonic Attenuation and Scattering Experiments

A. Wydra, A. M. Chertov, R. Gr Maev, C. M. Kube, H. Du, J. A. Turner

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Fingerprint Dive into the research topics of 'Grain Size Measurement of Copper Spot Welding Caps Via Ultrasonic Attenuation and Scattering Experiments'. Together they form a unique fingerprint.

Physics & Astronomy

Chemical Compounds

Engineering & Materials Science