High performance isotropic polymer/metal composite for interconnect applications

R. F. Saraf, J. M. Roldan, C. J. Sambucetti, M. A. Gaynes, R. Lewis

Research output: Contribution to conferencePaper

2 Scopus citations

Abstract

A paste composed of thermoplastic binder, silver particles, and solvent is compounded for directly interconnecting a chip to a substrate. The thermoplastic nature of the binder has three distinct advantages: (i) the interconnection is fully reworkable, (ii) the bonding time interval between the dispensing and assembling operation is indefinite, enabling a true 'bumping' technology and (iii) the paste is stored at room temperature with well over 6 month shelf-life. The bond is formed by drying the solvent and applying pressure at a bond temperature above the glass transition temperature of the polymer. The resultant polymer/metal composite (PMC) bond is an isotropic conductor with electrical conductivity provided by continuous channels of Ag particles. With PMC electrical conductivity higher than solder and fine-pitch screenability, we are developing this material as an interconnect for flip-chip attach (FCA) technology. In this paper, we report our results on the dispensability and rheological behavior of the paste and some results on our bonding process optimization study using response surface analysis.

Original languageEnglish (US)
Pages425-428
Number of pages4
StatePublished - 1995
EventProceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology - Omiya, Jpn
Duration: Dec 4 1995Dec 6 1995

Other

OtherProceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology
CityOmiya, Jpn
Period12/4/9512/6/95

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Saraf, R. F., Roldan, J. M., Sambucetti, C. J., Gaynes, M. A., & Lewis, R. (1995). High performance isotropic polymer/metal composite for interconnect applications. 425-428. Paper presented at Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology, Omiya, Jpn, .