Influence of workpiece materials on machining performance in micro ultrasonic machining

X. Hu, Z. Yu, K. P. Rajurkar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

Micro Ultrasonic Machining (USM) is a promising micromachining process to generate micro features in brittle and hard materials. However, the factors determining the performance of micro USM are not fully characterized. In this study, the influence of workpiece materials on machining performance of micro USM is investigated. Representative hard and brittle materials (silicon, glass, hot pressed silicon carbide and sintered alumina) are selected as workpiece materials and tungsten as tool material. It is found that the material removal rate generally increases with the decrease of the material fracture toughness. Tool wear rate is insignificantly affected by the type of workpiece material. The microstructure and localized fracture mechanism of materials seem to affect the machined surface characteristics. Low fracture toughness of workpiece material leads to easy edge cracking of machined feature. The strength of intergranular bonding in ceramics may affect the machining mode, and, therefore, material removal rate and generated surface.

Original languageEnglish (US)
Title of host publicationProceedings of the 15th International Symposium on Electromachining, ISEM 2007
EditorsMurali Meenakshi Sundaram, K.P. Rajurkar, Ralph L. Resnick
PublisherIndustrial and Management Systems Engineering
Pages381-386
Number of pages6
ISBN (Electronic)0979497701, 9780979497704
StatePublished - 2007
Event15th International Symposium on Electromachining, ISEM 2007 - Pittsburgh, United States
Duration: Apr 23 2007Apr 27 2007

Publication series

NameProceedings of the 15th International Symposium on Electromachining, ISEM 2007

Other

Other15th International Symposium on Electromachining, ISEM 2007
Country/TerritoryUnited States
CityPittsburgh
Period4/23/074/27/07

Keywords

  • Intergranular cracking
  • Machining mode
  • Micro USM
  • Microstructure

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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