Laser applications in integrated circuits and photonics packaging

Y. F. Lu, L. P. Li, K. Mendu, J. Shi

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash from heat sinks and lead wires of IC packages, laser singulation of BGA (ball grid array) and CSP (chip scale packages), laser reflow of solder ball on GBA, laser peeling for CSP, laser marking on packages and on Si wafers. Laser nanoimprinting of self-assembled nanoparticles has been recently developed to fabricate hemispherical cavity arrays on semiconductor surfaces. This process has the potential applications in fabrication and packaging of photonic devices such as waveguides and optical interconnections. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to be taken into account. Monitoring of laser-induced plasma has been used to understand and to control the processes involved in these applications. Numerical simulations can provide useful information on process analysis and optimization.

Original languageEnglish (US)
Pages (from-to)427-440
Number of pages14
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5339
DOIs
StatePublished - 2004
EventPhoton Processing in Microelectronics and Photonics III - San Jose, CA, United States
Duration: Jan 26 2004Jan 29 2004

Keywords

  • Laser bumping
  • Laser deflash
  • Laser mold cleaning
  • Laser nanoimprinting
  • Laser packaging
  • Laser reflow
  • Laser singulation
  • Laser tagging
  • Self-assembled particles

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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