Nanoscale structuring is a promising area in which the various processing methods are being developed. Based on the advantages of laser processing, associated with improved self-assembly technique, it is very effective to fabricate nanoscale structures, such as 3-D photonic bandgap structures, especially on the materials with high hardness and high melting point. This new approach to fabricating 3-D photonic bandgap structures on silicon will be presented. Self-assembly technique was used to deposit multi-layer of silica microparticles with a size of 0.81 μm. A pulsed KrF excimer laser (23 ns, 248 nm) was applied as the imprinting energy source.
|Original language||English (US)|
|State||Published - Nov 28 2006|
|Event||International Conference on Manufacturing Science and Engineering, MSEC 2006 - Ypsilanti, MI, United States|
Duration: Oct 8 2006 → Oct 11 2006
|Conference||International Conference on Manufacturing Science and Engineering, MSEC 2006|
|Period||10/8/06 → 10/11/06|
ASJC Scopus subject areas