Abstract
Surface contaminations are removed by laser irradiation with pulse output and short wavelength. It is a new dry cleaning process to remove surface organic contaminations without using ultrasonic cleaning with carbon fluorochloride (CFC) and other organic solvents. This provides a new dry process to clean different substrate sur-faces and can take the place of conventional wet cleaning processes such as ultrasonic cleaning with CFC and other organic solvents. The mechanisms of laser cleaning may include laser photodecomposition, laser ablation and surface vibration due to the impact of laser pulse.
Original language | English (US) |
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Pages (from-to) | L430-L433 |
Journal | Japanese Journal of Applied Physics |
Volume | 33 |
Issue number | 3 |
DOIs | |
State | Published - Mar 1994 |
Externally published | Yes |
Keywords
- CFC-free cleaning
- Dry process
- Fingerprint removal
- Laser cleaning
- Magnetic head cleaning
- Metal surface cleaning
- Surface cleaning
- UV pulse laser
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)