Laser-induced removal of flash from heat sinks in integrated circuit packages

W. D. Song, M. H. Hong, S. M. Huang, S. Y. Chan, Y. F. Lu, T. C. Chong

Research output: Contribution to journalArticle

4 Scopus citations

Abstract

Laser-induced removal of flash from heat sinks in integrated circuit (IC) packages has been studied. It is found that flash can be effectively removed from heat sinks in plastic IC packages by laser deflashing. An optical microscope, an α-step surface profiler and X-ray photoelectron spectroscopy are used to analyze the deflashing efficiency. Laser deflashing of IC packages is based on laser ablation of flash materials. With an increase of laser fluence, the ablation rate increases. The laser fluence is selected between the ablation threshold of flash materials and that of heat-sink materials. An acoustic wave is generated by laser ablation of flash materials. Acoustic wave detection is used to monitor the surface cleanness during laser deflashing and to determine the ablation threshold of flash materials.

Original languageEnglish (US)
Pages (from-to)519-523
Number of pages5
JournalApplied Physics A: Materials Science and Processing
Volume75
Issue number4
DOIs
StatePublished - Oct 2002

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Science(all)

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