Laser marking on IC package by micro-encapsulated tapes

Ye Kaidong, An ChengWu, Yuan Yuan, Lu Yong Feng

Research output: Contribution to journalArticlepeer-review

Abstract

In this paper, we are reporting a new way to do marking on IC package. In the way, white ink is wrapped in microcapsules that are coated on a transparent tape. Laser is irradiated on the tape surface, break the microcapsules and release the ink on to the IC package surface. After an UV light treatment, the ink will stick on the IC surface, forming a high contrast marking. It is found that the quality of the marking depends on tape configuration, tape-IC distance, laser peak power, scan speed of laser irradiation and other laser parameters.

Original languageEnglish (US)
Pages (from-to)355-358
Number of pages4
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4426
DOIs
StatePublished - 2002
Externally publishedYes

Keywords

  • IC-package
  • Laser marking

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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