Laser processing of polytetrafluoroethylene (Teflon) in air

Z. B. Wang, M. H. Hong, Y. F. Lu, T. C. Chong

Research output: Contribution to journalConference article

Abstract

Teflon, polytetrafluorethylene (PTFE), is an important material in bioscience and medical application due to its special characteristics (non-flammable, anti-adhesive, heat-resistant and bio-compatible). The advantages of ultrashort laser processing of Teflon include a minimal thermal penetration region and low processing temperatures, precision removal of material, and good-quality feature definition. In this paper, laser processing of Teflon by Ti: Sapphire femtosecond laser (780 nm, 110 fs), Nd:YAG laser (532 nm, 7 ns) and CO2 laser (10.6 μm, 10 μs) has been investigated. For femtosecond laser processing, clear ablation takes place and provides high-quality groove on Teflon surface. Both the groove depth and the width increase as the laser fluence increase, and decrease almost linearly as the scanning speed increase for laser fluences below 5.0 J/cm2. For NdrYAG processing, Teflon surface roughness is improved but no clean ablation is accessible, which makes it difficult to micromachine Teflon by Nd:YAG laser. For CO2 laser processing, laser-induced bumps were formed on Teflon surface with controlled laser parameters. The physics mechanisms for different pulse duration laser processing of Teflon are also discussed.

Original languageEnglish (US)
Pages (from-to)544-549
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4830
DOIs
StatePublished - 2002
EventThird International Symposium on Laser Precision Microfabrication - Osaka, Japan
Duration: May 27 2002May 31 2002

Keywords

  • Laser ablation
  • Micromachining
  • Teflon PTFE
  • Ultrashort laser

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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