Laser processing of polytetrafluoroethylene (Teflon) in air

Z. B. Wang; M. H. Hong; Y. F. Lu; T. C. Chong

doi:10.1117/12.486544

Laser processing of polytetrafluoroethylene (Teflon) in air

Z. B. Wang, M. H. Hong, Y. F. Lu, T. C. Chong

Research output: Contribution to journal › Conference article › peer-review

Abstract

Teflon, polytetrafluorethylene (PTFE), is an important material in bioscience and medical application due to its special characteristics (non-flammable, anti-adhesive, heat-resistant and bio-compatible). The advantages of ultrashort laser processing of Teflon include a minimal thermal penetration region and low processing temperatures, precision removal of material, and good-quality feature definition. In this paper, laser processing of Teflon by Ti: Sapphire femtosecond laser (780 nm, 110 fs), Nd:YAG laser (532 nm, 7 ns) and CO₂ laser (10.6 μm, 10 μs) has been investigated. For femtosecond laser processing, clear ablation takes place and provides high-quality groove on Teflon surface. Both the groove depth and the width increase as the laser fluence increase, and decrease almost linearly as the scanning speed increase for laser fluences below 5.0 J/cm². For NdrYAG processing, Teflon surface roughness is improved but no clean ablation is accessible, which makes it difficult to micromachine Teflon by Nd:YAG laser. For CO₂ laser processing, laser-induced bumps were formed on Teflon surface with controlled laser parameters. The physics mechanisms for different pulse duration laser processing of Teflon are also discussed.

Original language	English (US)
Pages (from-to)	544-549
Number of pages	6
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4830
DOIs	https://doi.org/10.1117/12.486544
State	Published - 2002
Externally published	Yes
Event	Third International Symposium on Laser Precision Microfabrication - Osaka, Japan Duration: May 27 2002 → May 31 2002

Keywords

Laser ablation
Micromachining
Teflon PTFE
Ultrashort laser

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.486544

Cite this

@article{7bad2c5ddd46401fae55eae0477796cb,

title = "Laser processing of polytetrafluoroethylene (Teflon) in air",

abstract = "Teflon, polytetrafluorethylene (PTFE), is an important material in bioscience and medical application due to its special characteristics (non-flammable, anti-adhesive, heat-resistant and bio-compatible). The advantages of ultrashort laser processing of Teflon include a minimal thermal penetration region and low processing temperatures, precision removal of material, and good-quality feature definition. In this paper, laser processing of Teflon by Ti: Sapphire femtosecond laser (780 nm, 110 fs), Nd:YAG laser (532 nm, 7 ns) and CO2 laser (10.6 μm, 10 μs) has been investigated. For femtosecond laser processing, clear ablation takes place and provides high-quality groove on Teflon surface. Both the groove depth and the width increase as the laser fluence increase, and decrease almost linearly as the scanning speed increase for laser fluences below 5.0 J/cm2. For NdrYAG processing, Teflon surface roughness is improved but no clean ablation is accessible, which makes it difficult to micromachine Teflon by Nd:YAG laser. For CO2 laser processing, laser-induced bumps were formed on Teflon surface with controlled laser parameters. The physics mechanisms for different pulse duration laser processing of Teflon are also discussed.",

keywords = "Laser ablation, Micromachining, Teflon PTFE, Ultrashort laser",

author = "Wang, {Z. B.} and Hong, {M. H.} and Lu, {Y. F.} and Chong, {T. C.}",

year = "2002",

doi = "10.1117/12.486544",

language = "English (US)",

volume = "4830",

pages = "544--549",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "Third International Symposium on Laser Precision Microfabrication ; Conference date: 27-05-2002 Through 31-05-2002",

}

TY - JOUR

T1 - Laser processing of polytetrafluoroethylene (Teflon) in air

AU - Wang, Z. B.

AU - Hong, M. H.

AU - Lu, Y. F.

AU - Chong, T. C.

PY - 2002

Y1 - 2002

N2 - Teflon, polytetrafluorethylene (PTFE), is an important material in bioscience and medical application due to its special characteristics (non-flammable, anti-adhesive, heat-resistant and bio-compatible). The advantages of ultrashort laser processing of Teflon include a minimal thermal penetration region and low processing temperatures, precision removal of material, and good-quality feature definition. In this paper, laser processing of Teflon by Ti: Sapphire femtosecond laser (780 nm, 110 fs), Nd:YAG laser (532 nm, 7 ns) and CO2 laser (10.6 μm, 10 μs) has been investigated. For femtosecond laser processing, clear ablation takes place and provides high-quality groove on Teflon surface. Both the groove depth and the width increase as the laser fluence increase, and decrease almost linearly as the scanning speed increase for laser fluences below 5.0 J/cm2. For NdrYAG processing, Teflon surface roughness is improved but no clean ablation is accessible, which makes it difficult to micromachine Teflon by Nd:YAG laser. For CO2 laser processing, laser-induced bumps were formed on Teflon surface with controlled laser parameters. The physics mechanisms for different pulse duration laser processing of Teflon are also discussed.

AB - Teflon, polytetrafluorethylene (PTFE), is an important material in bioscience and medical application due to its special characteristics (non-flammable, anti-adhesive, heat-resistant and bio-compatible). The advantages of ultrashort laser processing of Teflon include a minimal thermal penetration region and low processing temperatures, precision removal of material, and good-quality feature definition. In this paper, laser processing of Teflon by Ti: Sapphire femtosecond laser (780 nm, 110 fs), Nd:YAG laser (532 nm, 7 ns) and CO2 laser (10.6 μm, 10 μs) has been investigated. For femtosecond laser processing, clear ablation takes place and provides high-quality groove on Teflon surface. Both the groove depth and the width increase as the laser fluence increase, and decrease almost linearly as the scanning speed increase for laser fluences below 5.0 J/cm2. For NdrYAG processing, Teflon surface roughness is improved but no clean ablation is accessible, which makes it difficult to micromachine Teflon by Nd:YAG laser. For CO2 laser processing, laser-induced bumps were formed on Teflon surface with controlled laser parameters. The physics mechanisms for different pulse duration laser processing of Teflon are also discussed.

KW - Laser ablation

KW - Micromachining

KW - Teflon PTFE

KW - Ultrashort laser

UR - http://www.scopus.com/inward/record.url?scp=0038636153&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0038636153&partnerID=8YFLogxK

U2 - 10.1117/12.486544

DO - 10.1117/12.486544

M3 - Conference article

AN - SCOPUS:0038636153

SN - 0277-786X

VL - 4830

SP - 544

EP - 549

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Third International Symposium on Laser Precision Microfabrication

Y2 - 27 May 2002 through 31 May 2002

ER -

Laser processing of polytetrafluoroethylene (Teflon) in air

Abstract

Keywords

ASJC Scopus subject areas

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