Abstract
The separation of IC packages from a BGA board is realized by means of laser multi-scan method. The laser used in the study is a double frequency Nd-YAG laser with wavelength of 532 nm. The big problem in the laser processing approach mainly arises from the multi-layer materials of BGA board with copper, polyethylene and epoxy glass fiber, because of their different absorption coefficient to the laser beam and their different heat conductivity. In the experiment approach, the effects of laser parameters, such as wavelength, on the dicing efficiency has been investigated for choosing laser. The influence of sample side for laser incidence on cut profile and, the influence of the focused extent of laser beam on singulation speed are discussed. The experimental results show that laser singulation of IC packages is efficient and reliable.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 371-373 |
| Number of pages | 3 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 4426 |
| DOIs | |
| State | Published - 2002 |
| Externally published | Yes |
| Event | Second International Symposium on Laser Precision Microfabrication - Singapore, Singapore Duration: May 16 2001 → May 18 2001 |
Keywords
- IC package
- Laser machining
- Multi-layer material cutting
- Multi-scan
- Singulation
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering