Mechanical compatibility of deposited films on a hard substrate

Y. F. Luo, K. P. Rajurkar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The bonding strength of deposited metallic films or strips on a hard substrate is investigated through micro-strength tests and micro-mechanics analyses. The combination of Ti:W-Au/Cu deposited directly on SiO2/Si substrate was taken as an example in the experiments conducted. Investigations and analyses resulted in a general model concerning the separation mechanism of thin ductile films from a hard brittle substrate. This separation model leads to some systematic methods of improving strip-substrate interconnection strength. Instead of strip-substrate adhesion, strip stiffness turns out to be a key factor for the bonding strength of such a system. Hardening processes such as post-deposition heat treatment and work-hardening are effective in strengthening the strips. These investigations also reveal a fundamental principle of mechanical compatibility concerning interface micro-deformation. This new understanding will help to improve common bonding strength problems of various interconnection structures and materials combinations in manufacturing technologies.

Original languageEnglish (US)
Title of host publicationManufacturing Aspects in Electronic Packaging
EditorsK.F. Ehmann
PublisherPubl by ASME
Pages93-104
Number of pages12
ISBN (Print)0791810321
StatePublished - 1993
EventProceedings of the 1993 ASME Winter Annual Meeting - New Orleans, LA, USA
Duration: Nov 28 1993Dec 3 1993

Publication series

NameAmerican Society of Mechanical Engineers, Production Engineering Division (Publication) PED
Volume65

Other

OtherProceedings of the 1993 ASME Winter Annual Meeting
CityNew Orleans, LA, USA
Period11/28/9312/3/93

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering

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