Abstract
Filling crystalline gaps with small molecules can drive interfacial healing between anisotropic solids. Sufficient mobility from these fillers allows the process to happen at a low temperature of -56 °C. Mended bulk crystals show modulus leap from 4 to 12 GPa and hardness from 400 to 1000 MPa.
Original language | English (US) |
---|---|
Pages (from-to) | 6106-6111 |
Number of pages | 6 |
Journal | Advanced Materials |
Volume | 25 |
Issue number | 42 |
DOIs | |
State | Published - Nov 13 2013 |
Keywords
- healing
- interfacial binding
- low temperatures
- metal-organic frameworks
- welding
ASJC Scopus subject areas
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering