Metal-organic frameworks capable of healing at low temperatures

Ziguang Chen, Gonghua Wang, Zhanping Xu, Hui Li, Alexandre Dhôtel, Xiao Cheng Zeng, Banglin Chen, Jean Marc Saiter, Li Tan

Research output: Contribution to journalArticlepeer-review

7 Scopus citations


Filling crystalline gaps with small molecules can drive interfacial healing between anisotropic solids. Sufficient mobility from these fillers allows the process to happen at a low temperature of -56 °C. Mended bulk crystals show modulus leap from 4 to 12 GPa and hardness from 400 to 1000 MPa.

Original languageEnglish (US)
Pages (from-to)6106-6111
Number of pages6
JournalAdvanced Materials
Issue number42
StatePublished - Nov 13 2013


  • healing
  • interfacial binding
  • low temperatures
  • metal-organic frameworks
  • welding

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering


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