Monitoring of steam laser cleaning using optical probe techniques

N. Batta, Y. F. Lu, Xinwei Wang, J. Shi, D. W. Thompson, D. W. Doerr, D. R. Alexander

Research output: Contribution to journalConference article

Abstract

Steam laser cleaning of alumina and titanium carbide nanoparticles from silicon substrates is presented. A KrF excimer laser with a wavelength of 248 nm was used to irradiate the substrates in laser cleaning. A water layer of micrometer thickness was deposited on silicon substrates to improve the cleaning process. Cleaning efficiency was measured for different laser fluences ranging from 50 to 250 mJ/cm 2 and pulse numbers from 1 to 100. Research work was carried out to address the factors governing steam laser cleaning, during which thickness of water thin film and lift-off velocities of water films from Si substrate surfaces were monitored. In addition, one-dimensional simulations were employed to estimate the temperature increase on the material surfaces upon laser irradiation. Water layer thickness was measured using Fourier Transform Infrared Spectroscopy. Monitoring of both lift-off velocities and water thin film removal time were carried out by optical probing approaches using He-Ne laser of 632.8 nm wavelength.

Original languageEnglish (US)
Article number63
Pages (from-to)436-444
Number of pages9
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5713
DOIs
StatePublished - 2005
EventPhoton Processing in Microelectronics and Photonics IV - San Jose, CA, United States
Duration: Jan 24 2005Jan 27 2005

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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