Abstract
The rheological, electrical and mechanical properties of a paste which is composed of a thermoplastic polymer, solvent and silver particles, and the resulting polymer/metal composite (PMC) which forms after the solvent from the paste has dried are reported. The paste properties indicate the applicability of the material for fine feature size interconnects such as required for flip-chip-attach. The adhesive and electrical properties of PMC demonstrates that this materials will be suitable as an interconnect media in high performance applications. Furthermore, the system chosen is reworkable and the bonding process is volatile-free and allows the solvent to be completely removed prior to the bonding step.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1051-1053 |
| Number of pages | 3 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| State | Published - 1995 |
| Externally published | Yes |
| Event | Proceedings of the 1995 45th Electronic Components & Technology Conference - Las Vegas, NV, USA Duration: May 21 1995 → May 24 1995 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering