Polymer/metal composite for interconnection technology

R. F. Saraf, J. M. Roldan, R. Jagannathan, C. Sambucetti, J. Marino, C. Jahnes

Research output: Contribution to journalConference articlepeer-review

11 Scopus citations


The rheological, electrical and mechanical properties of a paste which is composed of a thermoplastic polymer, solvent and silver particles, and the resulting polymer/metal composite (PMC) which forms after the solvent from the paste has dried are reported. The paste properties indicate the applicability of the material for fine feature size interconnects such as required for flip-chip-attach. The adhesive and electrical properties of PMC demonstrates that this materials will be suitable as an interconnect media in high performance applications. Furthermore, the system chosen is reworkable and the bonding process is volatile-free and allows the solvent to be completely removed prior to the bonding step.

Original languageEnglish (US)
Pages (from-to)1051-1053
Number of pages3
JournalProceedings - Electronic Components and Technology Conference
StatePublished - 1995
Externally publishedYes
EventProceedings of the 1995 45th Electronic Components & Technology Conference - Las Vegas, NV, USA
Duration: May 21 1995May 24 1995

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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