Pool Boiling Heat Transfer Enhancement Using Femtosecond Laser Surface Processed Aluminum in Saturated PF-5060

Justin Costa-Greger, Logan Pettit, Andrew Reicks, Suchit Sarin, Chase Pettit, Jeffrey Shield, Craig Zuhlke, George Gogos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, pool boiling results using functionalized 6061 aluminum surfaces with PF-5060 as the working fluid are presented. Femtosecond laser surface processing (FLSP) is used as a surface modification technique to create self-organized, multiscale surface features which lead to additional nucleation sites and augmented surface area available for heat transfer. Two functionalized surfaces were fabricated by varying the laser fluence at a fixed pulse count to examine the impact of surface morphology on the heat transfer performance. In addition, each surface was tested under two conditions: as processed and post processed. Post processing consisted of a 60-minute ultrasonic bath to remove loosely adhered nanoparticles. Each surface was tested up to critical heat flux (CHF) and compared to a polished baseline sample. Results reveal drastically enhanced performance compared to the polished surface. The greatest increase in the maximum heat transfer coefficient was 459% for an FLSP surface without post processing. As processed only samples were shown to have a minor impact on the CHF, however, the inclusion of a post processing ultrasonic bath had significantly larger adverse effects on the CHF compared to their as processed counterparts. This adverse impact on the CHF arose from altering the nano-porous layer covering each surface feature, thereby reducing the surfaces' ability to draw in cooler replenishing liquid to delay CHF. This work demonstrates the potential of FLSP-functionalized aluminum surfaces as a viable means of achieving significant two-phase heat transfer enhancement with dielectric fluids.

Original languageEnglish (US)
Title of host publicationProceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
PublisherIEEE Computer Society
ISBN (Electronic)9781665485036
DOIs
StatePublished - 2022
Event21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022 - San Diego, United States
Duration: May 31 2022Jun 3 2022

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2022-May
ISSN (Print)1936-3958

Conference

Conference21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
Country/TerritoryUnited States
CitySan Diego
Period5/31/226/3/22

Keywords

  • critical heat flux
  • dielectric fluid
  • femtosecond laser surface processing
  • heat transfer coefficient enhancement
  • pool boiling

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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