TY - GEN
T1 - Pool Boiling Heat Transfer Enhancement Using Femtosecond Laser Surface Processed Aluminum in Saturated PF-5060
AU - Costa-Greger, Justin
AU - Pettit, Logan
AU - Reicks, Andrew
AU - Sarin, Suchit
AU - Pettit, Chase
AU - Shield, Jeffrey
AU - Zuhlke, Craig
AU - Gogos, George
N1 - Funding Information:
ACKNOWLEDGEMENTS This material is based upon research supported by, or in part by, the Office of Naval Research under award number N00014-20-1-2025. Manufacturing and characterization analysis were performed at the NanoEngineering Research Core Facility, University of Nebraska-Lincoln, which is partially funded from the Nebraska Research Initiative funds.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - In this work, pool boiling results using functionalized 6061 aluminum surfaces with PF-5060 as the working fluid are presented. Femtosecond laser surface processing (FLSP) is used as a surface modification technique to create self-organized, multiscale surface features which lead to additional nucleation sites and augmented surface area available for heat transfer. Two functionalized surfaces were fabricated by varying the laser fluence at a fixed pulse count to examine the impact of surface morphology on the heat transfer performance. In addition, each surface was tested under two conditions: as processed and post processed. Post processing consisted of a 60-minute ultrasonic bath to remove loosely adhered nanoparticles. Each surface was tested up to critical heat flux (CHF) and compared to a polished baseline sample. Results reveal drastically enhanced performance compared to the polished surface. The greatest increase in the maximum heat transfer coefficient was 459% for an FLSP surface without post processing. As processed only samples were shown to have a minor impact on the CHF, however, the inclusion of a post processing ultrasonic bath had significantly larger adverse effects on the CHF compared to their as processed counterparts. This adverse impact on the CHF arose from altering the nano-porous layer covering each surface feature, thereby reducing the surfaces' ability to draw in cooler replenishing liquid to delay CHF. This work demonstrates the potential of FLSP-functionalized aluminum surfaces as a viable means of achieving significant two-phase heat transfer enhancement with dielectric fluids.
AB - In this work, pool boiling results using functionalized 6061 aluminum surfaces with PF-5060 as the working fluid are presented. Femtosecond laser surface processing (FLSP) is used as a surface modification technique to create self-organized, multiscale surface features which lead to additional nucleation sites and augmented surface area available for heat transfer. Two functionalized surfaces were fabricated by varying the laser fluence at a fixed pulse count to examine the impact of surface morphology on the heat transfer performance. In addition, each surface was tested under two conditions: as processed and post processed. Post processing consisted of a 60-minute ultrasonic bath to remove loosely adhered nanoparticles. Each surface was tested up to critical heat flux (CHF) and compared to a polished baseline sample. Results reveal drastically enhanced performance compared to the polished surface. The greatest increase in the maximum heat transfer coefficient was 459% for an FLSP surface without post processing. As processed only samples were shown to have a minor impact on the CHF, however, the inclusion of a post processing ultrasonic bath had significantly larger adverse effects on the CHF compared to their as processed counterparts. This adverse impact on the CHF arose from altering the nano-porous layer covering each surface feature, thereby reducing the surfaces' ability to draw in cooler replenishing liquid to delay CHF. This work demonstrates the potential of FLSP-functionalized aluminum surfaces as a viable means of achieving significant two-phase heat transfer enhancement with dielectric fluids.
KW - critical heat flux
KW - dielectric fluid
KW - femtosecond laser surface processing
KW - heat transfer coefficient enhancement
KW - pool boiling
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U2 - 10.1109/iTherm54085.2022.9899590
DO - 10.1109/iTherm54085.2022.9899590
M3 - Conference contribution
AN - SCOPUS:85140771520
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
BT - Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
PB - IEEE Computer Society
T2 - 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
Y2 - 31 May 2022 through 3 June 2022
ER -