Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures

Ying Liu, Wei Xiong, Da Wei Li, Yao Lu, Xi Huang, Huan Liu, Li Sha Fan, Lan Jiang, Jean François Silvain, Yong Feng Lu

Research output: Contribution to journalArticlepeer-review

17 Scopus citations

Abstract

Three-dimensional (3D) electrically conductive micro/nanostructures are now a key component in a broad range of research and industry fields. In this work, a novel method is developed to realize metallic 3D micro/nanostructures with silver-thiol-acrylate composites via two-photon polymerization followed by femtosecond laser nanojoining. Complex 3D micro/nanoscale conductive structures have been successfully fabricated with ∼200 nm resolution. The loading of silver nanowires (AgNWs) and joining of junctions successfully enhance the electrical conductivity of the composites from insulating to 92.9 S m−1 at room temperature. Moreover, for the first time, a reversible switching to a higher conductivity is observed, up to ∼105 S m−1 at 523 K. The temperature-dependent conductivity of the composite is analyzed following the variable range hopping and thermal activation models. The nanomaterial assembly and joining method demonstrated in this study pave a way towards a wide range of device applications, including 3D electronics, sensors, memristors, micro/nanoelectromechanical systems, and biomedical devices, etc.

Original languageEnglish (US)
Article number025001
JournalInternational Journal of Extreme Manufacturing
Volume1
Issue number2
DOIs
StatePublished - Jun 2019

Keywords

  • Joining
  • Nanofabrication
  • Precise assembly
  • Silver nanowires
  • Three dimensional

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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