Pulsed laser ablation of IC packages for the device failure analyses

M. H. Hong, Z. H. Mai, G. X. Chen, T. Thiam, W. D. Song, Y. F. Lu, C. E. Soh, T. C. Chong

Research output: Contribution to journalArticle

8 Scopus citations

Abstract

Pulsed laser ablation of mold compounds for IC packaging in air and with steam assistance is investigated. It is applied to decap IC packages and expose computer CPU dies for the device failure analyses. Compared with chemical decapping, the laser ablation has advantages of being fast speed, non-contact & dry processing. Laser ablation with the steam assistance results in higher ablation rate and wider ablated crater with much smoother surface morphology. It implies that the steam assisted laser ablation can achieve a faster and better quality laser processing. Audible acoustic wave and plasma optical signal diagnostics are also carried out to have a better understanding of the mechanisms behind. Light wavelength and laser fluence applied in the decapping are two important parameters. The 532 nm Nd:YAG laser decapping at a low laser fluence can achieve a large decapping area with a fine ablation profile. IC packages decapped by the laser ablation show good quality for the device failure analyses.

Original languageEnglish (US)
Pages (from-to)445-452
Number of pages8
JournalProceedings of SPIE-The International Society for Optical Engineering
Volume4637
DOIs
StatePublished - Jan 1 2002

Keywords

  • Laser ablation
  • Mold compounds and device failure analyses
  • Steam assistance

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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