Rapid thermal curing of polyimides

S. E. Molis, R. Saraf, R. T. Hodgson

Research output: Contribution to conferencePaperpeer-review

Abstract

We have investigated the polyimide systems PMDA-ODA and BPDA-PDA using infrared spectroscopy, X-ray diffraction and microscopic birefringence studies. Samples cured with slow thermal ramps have been found to have less intermolecular packing orded and a greater orientation anisotropy than those cured with rapid thermal curing. This research indicates that Polyimides cure cycles may be shortened significantly, thus achieving higher productivity and greater cost efficiency.

Original languageEnglish (US)
StatePublished - Oct 1991
EventAbstracts of the 4th International Conference on Polyimides - Ellenville, NY, USA
Duration: Oct 30 1991Nov 1 1991

Other

OtherAbstracts of the 4th International Conference on Polyimides
CityEllenville, NY, USA
Period10/30/9111/1/91

ASJC Scopus subject areas

  • Chemical Engineering (miscellaneous)
  • Polymers and Plastics

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