TY - JOUR
T1 - Refractory Vertically Aligned Carbon Nanotube-Boron Nitride Nanocomposites for Scalable Electrical Anisotropic Interconnects
AU - Zou, Qi Ming
AU - Deng, Lei Min
AU - Fan, Pei Xun
AU - Li, Da Wei
AU - Zhang, Chen Fei
AU - Fan, Li Sha
AU - Jiang, Lan
AU - Silvain, Jean Francois
AU - Lu, Yong Feng
PY - 2019/1/25
Y1 - 2019/1/25
N2 - Traditional metal interconnect technology faces several challenges when scaling down, such as electromigration and poisoning. Carbon nanotubes (CNTs) have been introduced in an attempt to solve these problems while providing on par performance. However, unexpected issues, such as great difficulty in manufacturing perfectly aligned CNTs and the undesired current leakage caused by electron percolation, still exist. In this work, we present novel vertically aligned CNT (VACNT)-based nanocomposites utilizing hexagonal boron nitride (h-BN) as intertube insulating/shielding layers that can be prepared in a scalable and controllable fashion. This composite material inherits the full advantages of the directional conductivity of VACNTs which are strongly enhanced by the intertube h-BN layer and demonstrate excellent electrical anisotropy. This composite material achieves conductivities of 1060.43 and 4.43 S m-1 along the directions parallel and perpendicular to the VACNTs, respectively, while the previously reported electrical conductivity of CNT-polymer and CNT-ceramic counterparts are well below 10-3 S m-1 isotropically. Because of its refractory ability, the h-BN layer can also protect the prepared nanocomposites from harsh oxidation and erosion, showing ultrahigh stability up to 1400 °C. These results reflect a giant step toward a simple, turnkey solution to an advanced CNT-based composite material for future electrical interconnect applications.
AB - Traditional metal interconnect technology faces several challenges when scaling down, such as electromigration and poisoning. Carbon nanotubes (CNTs) have been introduced in an attempt to solve these problems while providing on par performance. However, unexpected issues, such as great difficulty in manufacturing perfectly aligned CNTs and the undesired current leakage caused by electron percolation, still exist. In this work, we present novel vertically aligned CNT (VACNT)-based nanocomposites utilizing hexagonal boron nitride (h-BN) as intertube insulating/shielding layers that can be prepared in a scalable and controllable fashion. This composite material inherits the full advantages of the directional conductivity of VACNTs which are strongly enhanced by the intertube h-BN layer and demonstrate excellent electrical anisotropy. This composite material achieves conductivities of 1060.43 and 4.43 S m-1 along the directions parallel and perpendicular to the VACNTs, respectively, while the previously reported electrical conductivity of CNT-polymer and CNT-ceramic counterparts are well below 10-3 S m-1 isotropically. Because of its refractory ability, the h-BN layer can also protect the prepared nanocomposites from harsh oxidation and erosion, showing ultrahigh stability up to 1400 °C. These results reflect a giant step toward a simple, turnkey solution to an advanced CNT-based composite material for future electrical interconnect applications.
KW - anisotropic
KW - boron nitride
KW - ceramic nanocomposites
KW - electrical interconnects
KW - vertically aligned carbon nanotube
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U2 - 10.1021/acsanm.8b01727
DO - 10.1021/acsanm.8b01727
M3 - Article
AN - SCOPUS:85078372893
VL - 2
SP - 100
EP - 108
JO - ACS Applied Nano Materials
JF - ACS Applied Nano Materials
SN - 2574-0970
IS - 1
ER -