Abstract
Micro Electrical Discharge Machining (EDM) generates micro holes in electrically conductive materials for many industrial applications. However, the presence and the difficulty in removal of debris formed during the erosion process limit the achievable aspect ratios. The flushing techniques used in macro EDM cannot be applied to micro EDM due to very small electrodes. The so-called "self-flushing" (resulting from the physical processes of the discharge phenomena and currently the only method of flushing in micro EDM) and its effect on the process stability and performance have not been well understood. This paper presents a preliminary investigation into the dielectric flow characteristics, gaseous bubble formation and pressure change and their effect on process performance. It has been found that higher capacitance leads to higher aspect ratio and the machining speed depends on parameters such as capacitance and hole size.
Original language | English (US) |
---|---|
Pages (from-to) | 81-88 |
Number of pages | 8 |
Journal | Transactions of the North American Manufacturing Research Institute of SME |
Volume | 33 |
State | Published - 2005 |
Event | North American Manufacturing Research Conference, NAMRC 33 - New York, NY, United States Duration: May 24 2005 → May 27 2005 |
Keywords
- Dielectric flow
- Micro EDM
- Micro hole
ASJC Scopus subject areas
- Mechanical Engineering
- Industrial and Manufacturing Engineering