Study of micro ultrasonic machining of silicon

Z. Yu, X. Hu, K. P. Rajurkar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Abstract

As a micro mechanical machining process, micro ultrasonic machining (micro USM) has the major advantage of producing micro-scale components or features in brittle (glass, quartz crystal, and sapphire) and hard (ceramics) materials. Micro USM is used to generate micro holes with 5μm in diameter and 3D micro cavities. However, the relationship of machining parameters such as static load, abrasive particle and amplitude of vibration and the material removal rate is not clearly understood. In this paper, a mathematical model is developed to describe the material removal process in micro USM. Experiments were carried out to verify the model. It was found that the machining speed decreases when the load is over a certain value, which is different from that of theoretical model. To understand this phenomenon, a simple model was proposed to analyze it qualitatively. It was found that the debris accumulation around the crater in a short time is the main reason resulting in the low machining efficiency.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, Manufacturing Engineering Division, MED
Pages1063-1070
Number of pages8
DOIs
StatePublished - 2005
Event2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005 - Orlando, FL, United States
Duration: Nov 5 2005Nov 11 2005

Publication series

NameAmerican Society of Mechanical Engineers, Manufacturing Engineering Division, MED
Volume16-2

Conference

Conference2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005
CountryUnited States
CityOrlando, FL
Period11/5/0511/11/05

Keywords

  • Debris Accumulation
  • Material Removal
  • Micro USM

ASJC Scopus subject areas

  • Engineering(all)

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