The need for complex and accurate microcomponents is increasing rapidly for many industrial and consumer products. The electrochemical machining (ECM) process has the potential of generating desired crack-free and stress-free surfaces of microcomponents. However, it is necessary to modify the existing ECM process for reduction of the interelectrode gap (improved accuracy) and higher localized electrochemical dissolution (smaller feature size). This paper reports a newly developed pulse electrochemical micromachining (ECMM) process for generating complex 21/2 and possibly 3-D microcomponents of high accuracy. A mathematical model based on the first principle of the process mechanism has been developed and experimentally verified using a recently designed and built ECMM system. The effect of voltage and feed rate on process performance has been studied. The application of the proposed method has been illustrated by machining complex cavities of 160 μm and 180 μm slot width with straight edges.
- Electrochemical Machining
- Microcomponent Manufacturing
- Pulse Electrochemical Micromachining
ASJC Scopus subject areas
- Strategy and Management
- Management Science and Operations Research
- Industrial and Manufacturing Engineering