Abstract
Microfabrication of sub-micron holes on 30 nm thick aluminum films on fused silica was investigated using pulse durations from 300 fs to 6 ns at 400 nm wavelength. Micromachines areas were investigated using atomic force microscopy (AFM) for quality and size of features produced. Ablation diameters less than 400 nm was achieved with all pulse widths. Pulses less than 5 ps removed the films cleanly and left a flat-bottomed crater with no evidence of substrate melting over a wide fluence range.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 62-67 |
| Number of pages | 6 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3874 |
| State | Published - 1999 |
| Event | Proceedings of the 1999 Micromachining and Microfabrication Process Technology V - Santa Clara, CA, USA Duration: Sep 20 1999 → Sep 22 1999 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering