Tantalum and chromium adhesion to polyimide. Part 1. BPDA-PDA surface imidization and modification

L. P. Buchwalter; R. Saraf

doi:10.1163/156856193X00925

Tantalum and chromium adhesion to polyimide. Part 1. BPDA-PDA surface imidization and modification

L. P. Buchwalter, R. Saraf

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

Abstract

BPDA-PDA (3,3’,4,4’-biphenyl dianhydride-p-phenylenediamine) tetracarboxylic acid derived polyimide (PI) surface imidization is initiated at the 230°C cure step and reaches completion at the 300°C bake. Exposure of BPDA-PDA to CF₄ reactive ion etching (RIE) results in a highly fluorinated surface, as expected. Ar sputter exposure of this highly fluorinated surface causes a significant reduction in the fluorine concentration and deposition of metal from the sample pallet. Scanning electron microscopy and atomic force microscopy analyses show that CF₄ RIE treatment results in significant surface roughening of the polyimide, whereas Ar sputtering smoothens the virgin and the CF₄ RIE exposed polyimide.

Original language	English (US)
Pages (from-to)	925-940
Number of pages	16
Journal	Journal of Adhesion Science and Technology
Volume	7
Issue number	9
DOIs	https://doi.org/10.1163/156856193X00925
State	Published - Jan 1 1993
Externally published	Yes

Keywords

Adhesion
Metal-polyimide
Polyimide
Surface roughness

ASJC Scopus subject areas

Chemistry(all)
Mechanics of Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

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10.1163/156856193X00925

Cite this

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title = "Tantalum and chromium adhesion to polyimide. Part 1. BPDA-PDA surface imidization and modification",

abstract = "BPDA-PDA (3,3{\textquoteright},4,4{\textquoteright}-biphenyl dianhydride-p-phenylenediamine) tetracarboxylic acid derived polyimide (PI) surface imidization is initiated at the 230°C cure step and reaches completion at the 300°C bake. Exposure of BPDA-PDA to CF4 reactive ion etching (RIE) results in a highly fluorinated surface, as expected. Ar sputter exposure of this highly fluorinated surface causes a significant reduction in the fluorine concentration and deposition of metal from the sample pallet. Scanning electron microscopy and atomic force microscopy analyses show that CF4 RIE treatment results in significant surface roughening of the polyimide, whereas Ar sputtering smoothens the virgin and the CF4 RIE exposed polyimide.",

keywords = "Adhesion, Metal-polyimide, Polyimide, Surface roughness",

author = "Buchwalter, {L. P.} and R. Saraf",

year = "1993",

month = jan,

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doi = "10.1163/156856193X00925",

language = "English (US)",

volume = "7",

pages = "925--940",

journal = "Journal of Adhesion Science and Technology",

issn = "0169-4243",

publisher = "Taylor and Francis Ltd.",

number = "9",

}

TY - JOUR

T1 - Tantalum and chromium adhesion to polyimide. Part 1. BPDA-PDA surface imidization and modification

AU - Buchwalter, L. P.

AU - Saraf, R.

PY - 1993/1/1

Y1 - 1993/1/1

N2 - BPDA-PDA (3,3’,4,4’-biphenyl dianhydride-p-phenylenediamine) tetracarboxylic acid derived polyimide (PI) surface imidization is initiated at the 230°C cure step and reaches completion at the 300°C bake. Exposure of BPDA-PDA to CF4 reactive ion etching (RIE) results in a highly fluorinated surface, as expected. Ar sputter exposure of this highly fluorinated surface causes a significant reduction in the fluorine concentration and deposition of metal from the sample pallet. Scanning electron microscopy and atomic force microscopy analyses show that CF4 RIE treatment results in significant surface roughening of the polyimide, whereas Ar sputtering smoothens the virgin and the CF4 RIE exposed polyimide.

AB - BPDA-PDA (3,3’,4,4’-biphenyl dianhydride-p-phenylenediamine) tetracarboxylic acid derived polyimide (PI) surface imidization is initiated at the 230°C cure step and reaches completion at the 300°C bake. Exposure of BPDA-PDA to CF4 reactive ion etching (RIE) results in a highly fluorinated surface, as expected. Ar sputter exposure of this highly fluorinated surface causes a significant reduction in the fluorine concentration and deposition of metal from the sample pallet. Scanning electron microscopy and atomic force microscopy analyses show that CF4 RIE treatment results in significant surface roughening of the polyimide, whereas Ar sputtering smoothens the virgin and the CF4 RIE exposed polyimide.

KW - Adhesion

KW - Metal-polyimide

KW - Polyimide

KW - Surface roughness

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JF - Journal of Adhesion Science and Technology

IS - 9

ER -

Tantalum and chromium adhesion to polyimide. Part 1. BPDA-PDA surface imidization and modification

Abstract

Keywords

ASJC Scopus subject areas

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