The effect of submicron grain size on thermal stability and mechanical properties of high-entropy carbide ceramics

Fei Wang, Xiang Zhang, Xueliang Yan, Yongfeng Lu, Michael Nastasi, Yan Chen, Bai Cui

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

(Hf0.2Zr0.2Ta0.2Nb0.2Ti0.2)C high-entropy ceramics (HEC) with a submicron grain size of 400 to 600 nm were fabricated by spark plasma sintering using a two-step sintering process. Both X-ray and neutron diffractions confirmed the formation of single-phase with rock salt structure in the as-fabricated (Hf0.2Zr0.2Ta0.2Nb0.2Ti0.2)C samples. The effect of submicron grain size on the thermal stability and mechanical properties of HEC was investigated. The grain growth kinetics in the fine-grained HEC was small at 1300 and 1600°C, suggesting high thermal stability that was possibly related to the compositional complexity and sluggish diffusion in HEC. Compared to the coarse-grain HEC with a grain size of 16.5 µm, the bending strength and fracture toughness of fine-grained HEC were 25% and 20% higher respectively. The improvement of mechanical properties in fine-grained HEC may be attributed to micromechanistic mechanisms such as crack deflection.

Original languageEnglish (US)
Pages (from-to)4463-4472
Number of pages10
JournalJournal of the American Ceramic Society
Volume103
Issue number8
DOIs
StatePublished - Aug 1 2020

Keywords

  • grain size
  • high-entropy ceramics
  • mechanical properties
  • spark plasma sintering
  • thermal stability

ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Chemistry

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