The Link between Spatial Skills and Engineering Problem-Solving

Gavin Duffy; Sheryl Sorby; Presentacion Rivera Reves; Tom Delahunty; Lance Perez; Javashri Ravishankar

doi:10.1109/TALE.2018.8615193

The Link between Spatial Skills and Engineering Problem-Solving

Gavin Duffy, Sheryl Sorby, Presentacion Rivera Reves, Tom Delahunty, Lance Perez, Javashri Ravishankar

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Well-developed 3-D spatial skills are correlated with engineering success. However, most studies examining the link between spatial skills and engineering success have been conducted at the macro level, i.e., the link between spatial skills and course grades or between spatial skills and graduation rates. In this research, a more refined approach has been taken. Relationships between spatial skills and success in solving certain types of problems that engineering students commonly encounter are examined. It was found that high levels of spatial skills predict success in solving certain types of engineering problems but not in all types of problems. Data gathered through this research will be further analyzed to determine characteristics of problems where spatial skills appear to play a role and characteristics where they do not.

Original language	English (US)
Title of host publication	Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018
Editors	Mark J.W. Lee, Sasha Nikolic, Gary K.W. Wong, Jun Shen, Montserrat Ros, Leon C. U. Lei, Neelakantam Venkatarayalu
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	272-278
Number of pages	7
ISBN (Electronic)	9781538665220
DOIs	https://doi.org/10.1109/TALE.2018.8615193
State	Published - Jan 16 2019
Event	2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018 - Wollongong, Australia Duration: Dec 4 2018 → Dec 7 2018

Publication series

Name	Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018

Conference

Conference	2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018
Country	Australia
City	Wollongong
Period	12/4/18 → 12/7/18

Keywords

engineering student success
problem-solving
spatial skills

ASJC Scopus subject areas

Education
Artificial Intelligence
Computer Networks and Communications
Engineering (miscellaneous)

Access to Document

10.1109/TALE.2018.8615193

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Cite this

Duffy, G., Sorby, S., Reves, P. R., Delahunty, T., Perez, L., & Ravishankar, J. (2019). The Link between Spatial Skills and Engineering Problem-Solving. In M. J. W. Lee, S. Nikolic, G. K. W. Wong, J. Shen, M. Ros, L. C. U. Lei, & N. Venkatarayalu (Eds.), Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018 (pp. 272-278). [8615193] (Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TALE.2018.8615193

The Link between Spatial Skills and Engineering Problem-Solving. / Duffy, Gavin; Sorby, Sheryl; Reves, Presentacion Rivera; Delahunty, Tom; Perez, Lance; Ravishankar, Javashri.

Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018. ed. / Mark J.W. Lee; Sasha Nikolic; Gary K.W. Wong; Jun Shen; Montserrat Ros; Leon C. U. Lei; Neelakantam Venkatarayalu. Institute of Electrical and Electronics Engineers Inc., 2019. p. 272-278 8615193 (Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Duffy, G, Sorby, S, Reves, PR, Delahunty, T, Perez, L & Ravishankar, J 2019, The Link between Spatial Skills and Engineering Problem-Solving. in MJW Lee, S Nikolic, GKW Wong, J Shen, M Ros, LCU Lei & N Venkatarayalu (eds), Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018., 8615193, Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018, Institute of Electrical and Electronics Engineers Inc., pp. 272-278, 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018, Wollongong, Australia, 12/4/18. https://doi.org/10.1109/TALE.2018.8615193

Duffy G, Sorby S, Reves PR, Delahunty T, Perez L, Ravishankar J. The Link between Spatial Skills and Engineering Problem-Solving. In Lee MJW, Nikolic S, Wong GKW, Shen J, Ros M, Lei LCU, Venkatarayalu N, editors, Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018. Institute of Electrical and Electronics Engineers Inc. 2019. p. 272-278. 8615193. (Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018). https://doi.org/10.1109/TALE.2018.8615193

Duffy, Gavin ; Sorby, Sheryl ; Reves, Presentacion Rivera ; Delahunty, Tom ; Perez, Lance ; Ravishankar, Javashri. / The Link between Spatial Skills and Engineering Problem-Solving. Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018. editor / Mark J.W. Lee ; Sasha Nikolic ; Gary K.W. Wong ; Jun Shen ; Montserrat Ros ; Leon C. U. Lei ; Neelakantam Venkatarayalu. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 272-278 (Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018).

@inproceedings{bca40c80e04d47d3af06fbdb20a83e39,

title = "The Link between Spatial Skills and Engineering Problem-Solving",

abstract = "Well-developed 3-D spatial skills are correlated with engineering success. However, most studies examining the link between spatial skills and engineering success have been conducted at the macro level, i.e., the link between spatial skills and course grades or between spatial skills and graduation rates. In this research, a more refined approach has been taken. Relationships between spatial skills and success in solving certain types of problems that engineering students commonly encounter are examined. It was found that high levels of spatial skills predict success in solving certain types of engineering problems but not in all types of problems. Data gathered through this research will be further analyzed to determine characteristics of problems where spatial skills appear to play a role and characteristics where they do not.",

keywords = "engineering student success, problem-solving, spatial skills",

author = "Gavin Duffy and Sheryl Sorby and Reves, {Presentacion Rivera} and Tom Delahunty and Lance Perez and Javashri Ravishankar",

year = "2019",

month = jan,

day = "16",

doi = "10.1109/TALE.2018.8615193",

language = "English (US)",

series = "Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "272--278",

editor = "Lee, {Mark J.W.} and Sasha Nikolic and Wong, {Gary K.W.} and Jun Shen and Montserrat Ros and Lei, {Leon C. U.} and Neelakantam Venkatarayalu",

booktitle = "Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018",

note = "2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018 ; Conference date: 04-12-2018 Through 07-12-2018",

}

TY - GEN

T1 - The Link between Spatial Skills and Engineering Problem-Solving

AU - Duffy, Gavin

AU - Sorby, Sheryl

AU - Reves, Presentacion Rivera

AU - Delahunty, Tom

AU - Perez, Lance

AU - Ravishankar, Javashri

PY - 2019/1/16

Y1 - 2019/1/16

N2 - Well-developed 3-D spatial skills are correlated with engineering success. However, most studies examining the link between spatial skills and engineering success have been conducted at the macro level, i.e., the link between spatial skills and course grades or between spatial skills and graduation rates. In this research, a more refined approach has been taken. Relationships between spatial skills and success in solving certain types of problems that engineering students commonly encounter are examined. It was found that high levels of spatial skills predict success in solving certain types of engineering problems but not in all types of problems. Data gathered through this research will be further analyzed to determine characteristics of problems where spatial skills appear to play a role and characteristics where they do not.

AB - Well-developed 3-D spatial skills are correlated with engineering success. However, most studies examining the link between spatial skills and engineering success have been conducted at the macro level, i.e., the link between spatial skills and course grades or between spatial skills and graduation rates. In this research, a more refined approach has been taken. Relationships between spatial skills and success in solving certain types of problems that engineering students commonly encounter are examined. It was found that high levels of spatial skills predict success in solving certain types of engineering problems but not in all types of problems. Data gathered through this research will be further analyzed to determine characteristics of problems where spatial skills appear to play a role and characteristics where they do not.

KW - engineering student success

KW - problem-solving

KW - spatial skills

UR - http://www.scopus.com/inward/record.url?scp=85062107108&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85062107108&partnerID=8YFLogxK

U2 - 10.1109/TALE.2018.8615193

DO - 10.1109/TALE.2018.8615193

M3 - Conference contribution

AN - SCOPUS:85062107108

T3 - Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018

SP - 272

EP - 278

BT - Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018

A2 - Lee, Mark J.W.

A2 - Nikolic, Sasha

A2 - Wong, Gary K.W.

A2 - Shen, Jun

A2 - Ros, Montserrat

A2 - Lei, Leon C. U.

A2 - Venkatarayalu, Neelakantam

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018

Y2 - 4 December 2018 through 7 December 2018

ER -