TY - GEN
T1 - Thermal cycle testing of titanium superhydrophobic surfaces for a spacecraft jumping droplet thermal diode
AU - Supowit, Jacob A.
AU - Baker, Christopher H.
AU - Zhao, Bailey
AU - McHale, John
AU - Miller, Ryan
AU - Pichardo, Patricia
AU - Zuhlke, Craig A.
AU - Roth, Nicholas
AU - Tsubaki, Alfred
AU - Mohammadi-Ghaleni, Mahdi
AU - Nejati, Siamak
AU - Alexander, Dennis R.
N1 - Publisher Copyright:
© 2018 by The Aerospace Corporation. Published by the American Institute of Aeronautics and Astronautics, Inc.
PY - 2018
Y1 - 2018
N2 - This work involved characterization and thermal cycle testing of superhydrophobic surfaces for application in a Jumping Droplet Thermal Diode. Three different superhydrophobic surfaces were fabricated and tested. Microstructures were created with a femtosecond laser on titanium substrates. Three techniques were used to further lower the surface energy of the surface: Submersion in fluorinated silane, vapor deposition of fluorinated silane, and grafting of PDFA. An experiment was built that utilized a thermoelectric cooler to cycle surface temperature, condense water vapor from ambient air, and observe droplet coalescence and self-propelled condensate removal. All three surfaces survived cycling through a temperature range of-30°C to 71°C.
AB - This work involved characterization and thermal cycle testing of superhydrophobic surfaces for application in a Jumping Droplet Thermal Diode. Three different superhydrophobic surfaces were fabricated and tested. Microstructures were created with a femtosecond laser on titanium substrates. Three techniques were used to further lower the surface energy of the surface: Submersion in fluorinated silane, vapor deposition of fluorinated silane, and grafting of PDFA. An experiment was built that utilized a thermoelectric cooler to cycle surface temperature, condense water vapor from ambient air, and observe droplet coalescence and self-propelled condensate removal. All three surfaces survived cycling through a temperature range of-30°C to 71°C.
UR - http://www.scopus.com/inward/record.url?scp=85051702942&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85051702942&partnerID=8YFLogxK
U2 - 10.2514/6.2018-2946
DO - 10.2514/6.2018-2946
M3 - Conference contribution
AN - SCOPUS:85051702942
SN - 9781624105524
T3 - 2018 Joint Thermophysics and Heat Transfer Conference
BT - 2018 Joint Thermophysics and Heat Transfer Conference
PB - American Institute of Aeronautics and Astronautics Inc, AIAA
T2 - 12th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, 2018
Y2 - 25 June 2018 through 29 June 2018
ER -