Thickness analysis of silicon membranes for stencil masks

E. Sossna; R. Kassing; I. W. Rangelow; C. M. Herzinger; T. E. Tiwald; J. A. Woollam; Th Wagner

doi:10.1116/1.1319827

Thickness analysis of silicon membranes for stencil masks

E. Sossna, R. Kassing, I. W. Rangelow, C. M. Herzinger, T. E. Tiwald, J. A. Woollam, Th Wagner

Research output: Contribution to journal › Conference article › peer-review

2 Scopus citations

Abstract

A technique to measure thickness uniformity and thermal emissive control for high quality masks, with adequate accuracy and precision is demonstrated. It is based on infrared variable angle spectroscopic ellipsometry (IR-VASE). Refractive index and the thickness of silicon membrane was determined. Depth profile of the optical constants and of the concentration of free carriers in membranes was also evaluated.

Original language	English (US)
Pages (from-to)	3259-3263
Number of pages	5
Journal	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume	18
Issue number	6
DOIs	https://doi.org/10.1116/1.1319827
State	Published - Nov 2000
Externally published	Yes
Event	44th International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication - Rancho Mirage, CA, USA Duration: May 30 2000 → Jun 2 2000

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

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10.1116/1.1319827

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title = "Thickness analysis of silicon membranes for stencil masks",

abstract = "A technique to measure thickness uniformity and thermal emissive control for high quality masks, with adequate accuracy and precision is demonstrated. It is based on infrared variable angle spectroscopic ellipsometry (IR-VASE). Refractive index and the thickness of silicon membrane was determined. Depth profile of the optical constants and of the concentration of free carriers in membranes was also evaluated.",

author = "E. Sossna and R. Kassing and Rangelow, {I. W.} and Herzinger, {C. M.} and Tiwald, {T. E.} and Woollam, {J. A.} and Th Wagner",

year = "2000",

month = nov,

doi = "10.1116/1.1319827",

language = "English (US)",

volume = "18",

pages = "3259--3263",

journal = "Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures",

issn = "1071-1023",

publisher = "AVS Science and Technology Society",

number = "6",

note = "44th International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication ; Conference date: 30-05-2000 Through 02-06-2000",

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TY - JOUR

T1 - Thickness analysis of silicon membranes for stencil masks

AU - Sossna, E.

AU - Kassing, R.

AU - Rangelow, I. W.

AU - Herzinger, C. M.

AU - Tiwald, T. E.

AU - Woollam, J. A.

AU - Wagner, Th

PY - 2000/11

Y1 - 2000/11

N2 - A technique to measure thickness uniformity and thermal emissive control for high quality masks, with adequate accuracy and precision is demonstrated. It is based on infrared variable angle spectroscopic ellipsometry (IR-VASE). Refractive index and the thickness of silicon membrane was determined. Depth profile of the optical constants and of the concentration of free carriers in membranes was also evaluated.

AB - A technique to measure thickness uniformity and thermal emissive control for high quality masks, with adequate accuracy and precision is demonstrated. It is based on infrared variable angle spectroscopic ellipsometry (IR-VASE). Refractive index and the thickness of silicon membrane was determined. Depth profile of the optical constants and of the concentration of free carriers in membranes was also evaluated.

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U2 - 10.1116/1.1319827

DO - 10.1116/1.1319827

M3 - Conference article

AN - SCOPUS:0034318138

SN - 1071-1023

VL - 18

SP - 3259

EP - 3263

JO - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

JF - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

IS - 6

T2 - 44th International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication

Y2 - 30 May 2000 through 2 June 2000

ER -

Thickness analysis of silicon membranes for stencil masks

Abstract

ASJC Scopus subject areas

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